Cameron Mortenson, Policy Director
The Department of Commerce officially finalized its agreement with Natcast to operate the National Semiconductor Technology Center (NSTC). Over the next 10 years, NSTC will execute on its strategic plan to:
- Extend U.S. technology leadership
- Reduce the time and cost to prototype
- Build and sustain a semiconductor workforce ecosystem
Through another announcement this week, the Department of Commerce announced $1.4 billion in funding to establish U.S. leadership in semiconductor advanced packaging and manufacturing. The funding announcement includes $1.1 Billion to the Natcast operated NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility in Tempe, Arizona. The announcement also includes $300 Million for advanced substrates and research to the following organizations:
- Absolics Inc – $100 Million to help build a glass-core packaging ecosystem.
- Applied Materials Inc – $100 Million to develop and scale a disruptive silicon-core substrate technology for next-generation advanced packaging and 3D heterogeneous integration.
- Arizona State University – $100 Million to support the development of the next generation of microelectronics packaging through fan-out-wafer-level-processing (FOWLP)
The Presidents Forum has been actively monitoring and engaging with CHIPS Act developments since its inception. Through regular updates and discussions, the Forum continues to track these transformative investments in American semiconductor capabilities, recognizing their critical importance to U.S. technological leadership and economic competitiveness.
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